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TDA2822 september 2003 dual power amplifier ? . supply voltage down to 3 v . low crossover distorsion . low quiescent current . bridge or stereo configuration description the TDA2822 is a monolithic integrated circuit in 12+2+2 powerdip, intended for use as dual audio power amplifier in portable radios and ts sets. powerdip (plastic 12+2+2) ordering number : TDA2822 typical application circuit (stereo) 1/11 obsolete product(s) - obsolete product(s)
schematic diagram absolute maximum ratings symbol parameter value unit v s supply voltage 15 v i o output peak current 1.5 a p tot total power dissipation at t amb = 50 c at t case = 70 c 1.25 4 w w t stg , t j storage and junction temperature C 40 to 150 c pin connection (top view) input+(1) n.c. input-(1) gnd gnd n.c. output(1) 1 3 2 4 5 6 7 n.c. gnd output(2) gnd input-(2) n.c. input+(2) 16 15 14 13 12 10 11 d95au321 +v s 8 n.c. 9 TDA2822 2/11 obsolete product(s) - obsolete product(s)
thermal data symbol parameter value unit r th j-amb r th j-case thermal resistance junction-ambient thermal resistance junction-pins max max 80 20 c/w c/w electrical characteristics (vs = 6 v, t amb = 25 c, unless otherwise specified) stereo (test circuit of fig. 1) symbol parameter test condition min. typ. max. unit v s supply voltage 3 15 v v c quiescent output voltage v s = 9 v v s = 6 v 4 2.7 v v i d quiescent drain current 6 12 ma i b input bias current 100 na p o output power (each channel) d = 10 % f = 1 khz v s = 9 v r l = 4 w v s = 6 v r l = 4 w v s = 4.5 v r l = 4 w 1.3 0.45 1.7 0.65 0.32 w w w g v closed loop voltage gain f = 1 khz 36 39 41 db r i input resistance f = 1 khz 100 k w e n total input noise r s = 10 k w b = 22 hz to 22 khz curve a 2.5 2 m v m v svr supply voltage rejection f = 100 hz 24 30 db cs channel separation r g = 10 k w f = 1 khz 50 db v s supply voltage 3 15 v i d quiescent drain current r l = 612ma v os output offset voltage r l = 8 w 10 60 mv i b input bias current 100 na p o output power d = 10 % f = 1 khz v s = 9 v r l = 8 w v s = 6 v r l = 8 w v s = 4.5 v r l = 4 w 2.7 0.9 3.2 1.35 1 w w w d distortion (f = 1 khz) r l = 8 w p o = 0.5 w 0.2 % g v closed loop voltage gain f = 1 khz 39 db r i input resistance f = 1 khz 100 k w e n total input noise r s = 10 k w b = 22 hz to 22 khz curve a 3 2.5 m v m v svr supply voltage rejection f = 100 hz 40 db TDA2822 3/11 obsolete product(s) - obsolete product(s)
figure 1 : test circuit (stereo). figure 2 : p.c. board and components layout of the circuit of figure 1 (1:1 scale). TDA2822 4/11 obsolete product(s) - obsolete product(s)
figure 3 : test circuit (bridge). figure 4 : p.c. board and components layout of the circuit of figure 3 (1:1 scale). TDA2822 5/11 obsolete product(s) - obsolete product(s)
figure 5 : output power vs. supply voltage (stereo). figure 6 : output power vs. supply voltage (bridge). figure 7 : distorsion vs. output power (bridge). figure 8 : distorsion vs. output power (bridge). figure 9 : supply voltage rejection vs. frequency. figure 10 : quiescent current vs. supply voltage. TDA2822 6/11 obsolete product(s) - obsolete product(s)
figure 11 : total power dissipation vs. output power (stereo). figure 12 : total power dissipation vs. output power (bridge). figure 13 : total power dissipation vs. output power (bridge). TDA2822 7/11 obsolete product(s) - obsolete product(s)
figure 14 : application circuit for portable radios. mounting instruction the r th j-amb of the TDA2822 can be reduced by sol- dering the gnd pins to a suitable copper area of the printed circuit board (figure 15) or to an external heatsink (figure 16). the diagram of figure 17 shows the maximum dis- sipable power p tot and the r th j-amb as a function of the side " ? " of two equal square copper areas having a thickness of 35 m (1.4 mils). during soldering the pins temperature must not ex- ceed 260 c and the soldering time must not be longer than 12 seconds. the external heatsink or printed circuit copper area must be connected to electrical ground. figure 15 : example of p.c. board copper area which is used as heatsink. figure 16 : external heatsink mounting example. TDA2822 8/11 obsolete product(s) - obsolete product(s)
figure 6 : maximum dissipable power and junction to ambient thermal resistance vs. side " ? ". figure 7 : maximum allowable power dissipation vs. ambient temperature. TDA2822 9/11 obsolete product(s) - obsolete product(s)
dim. mm inch min. typ. max. min. typ. max. a1 0.51 0.020 b 0.85 1.40 0.033 0.055 b 0.50 0.020 b1 0.38 0.50 0.015 0.020 d 20.0 0.787 e 8.80 0.346 e 2.54 0.100 e3 17.78 0.700 f 7.10 0.280 i 5.10 0.201 l 3.30 0.130 z 1.27 0.050 powerdip 16 outline and mechanical data TDA2822 10/11 obsolete product(s) - obsolete product(s)
information furnished is believed to be accurate and reliable. however, stmicroelectronics assumes no responsib ility for the conse- quences of use of such information nor for any infringement of patents or other rights of third parties which may result from i ts use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specifications mentione d in this publication are subject to change without notice. this publication supersedes and replaces all information previously supplied. stmi- croelectronics products are not authorized for use as critical components in life support devices or systems without express wr itten approval of stmicroelectronics. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners ? 2003 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia C belgium - brazil - canada - china C czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states www.st.com TDA2822 11/11 obsolete product(s) - obsolete product(s)

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